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ice:pcb_mechanics [2014/07/02 11:23]
jtshugrue [PCB Dimensions]
ice:pcb_mechanics [2014/07/02 11:24]
jtshugrue Added another sil pad figure ref
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 </WRAP> </WRAP>
 ===== Thermal Management ===== ===== Thermal Management =====
-Each PCB exposes up to 4 copper tabs to conduct heat out from power dissipating components to an external heat sink. The copper tabs are not electrically isolated, so electrical isolation is **required** at the interface between the heatsink and copper tab. Failure to isolate these tabs will result in malfunction of the ICE module. For electrical isolation with good thermal conductivity, [[http://www.bergquistcompany.com/thermal_materials/sil-pad.htm|Sil-Pad]] can be used. Sil-Pad requires a certain amount of pressure to ensure good thermal conductivity, so a clamp mechanism should be applied to the copper tabs. In the <imgref stackup3>, the Sil-Pad is shown in pink. In the [[ice:enclosure|ICE Platform]] enclosure, a wedge-based clamping system is used. The mechanics and dimensions of this are detailed below+Each PCB exposes up to 4 copper tabs to conduct heat out from power dissipating components to an external heat sink. The copper tabs are not electrically isolated, so electrical isolation is **required** at the interface between the heatsink and copper tab. Failure to isolate these tabs will result in malfunction of the ICE module. For electrical isolation with good thermal conductivity, [[http://www.bergquistcompany.com/thermal_materials/sil-pad.htm|Sil-Pad]] can be used. Sil-Pad requires a certain amount of pressure to ensure good thermal conductivity, so a clamp mechanism should be applied to the copper tabs. In the <imgref singlePCB> and <imgref stackup3>, the Sil-Pad is shown in pink. In the [[ice:enclosure|ICE Platform]] enclosure, a wedge-based clamping system is used. The mechanics and dimensions of this are detailed below
 <WRAP center round important 60%> <WRAP center round important 60%>
 The copper tabs **must** be electrically isolated from the heatsink. For electrical isolation with good thermal conductivity, [[http://www.bergquistcompany.com/thermal_materials/sil-pad.htm|Sil-Pad]] can be used. The copper tabs **must** be electrically isolated from the heatsink. For electrical isolation with good thermal conductivity, [[http://www.bergquistcompany.com/thermal_materials/sil-pad.htm|Sil-Pad]] can be used.
ice/pcb_mechanics.txt · Last modified: 2014/07/30 18:37 (external edit)