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ice:pcb_mechanics [2014/07/02 18:10] – [PCB Dimensions] jtshugrue | ice:pcb_mechanics [2014/07/02 18:23] – [PCB Dimensions] jtshugrue |
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This page presents the mechanical specifications for PCB's in the ICE Platform when being integrated by an OEM. | This page presents the mechanical specifications for PCB's in the ICE Platform when being integrated by an OEM. |
===== PCB Dimensions ===== | ===== PCB Dimensions ===== |
All PCB's in the ICE Platform follow identical board dimensions and header/mounting hole locations. The PCB's themselves are 4 inches square and contain 4 mounting holes for 4-40 screws on each corner. The dimensions of the boards are shown in <imgref singlePCB>. All contain a power bus header on each side ([[http://cloud.samtec.com/catalog_english/ESQ_TH.PDF|Samtec PN: ESQ-106-13-T-D]]) and a digital communications bus header ([[http://cloud.samtec.com/catalog_english/ESQ_TH.PDF|Samtec PN: ESQ-104-13-T-D]]) in the middle of the PCB. These headers are 0.1 inch pitch board-to-board headers that allow interconnection between boards when stacked, as shown in the [[pcb_mechanics#PCB Stackup|next section]]. At the edge of the board there are copper tabs extending from four IC's (TO-220 package) for heatsinking. Details on proper heatsinking are described in a [[pcb_mechanics#Thermal Management|later section]]. Note that not all boards will utilize all four heatsinking positions. | All PCB's in the ICE Platform follow identical board dimensions and header/mounting hole locations. The PCB's themselves are 4 inches square and contain 4 mounting holes for 4-40 screws on each corner. The dimensions of the boards are shown in <imgref singlePCB>. All contain a power bus header on each side ([[http://cloud.samtec.com/catalog_english/ESQ_TH.PDF|Samtec PN: ESQ-106-13-T-D]]) and a digital communications bus header ([[http://cloud.samtec.com/catalog_english/ESQ_TH.PDF|Samtec PN: ESQ-104-13-T-D]]) in the middle of the PCB. These headers are 0.1 inch pitch board-to-board headers that allow interconnection between boards when stacked, as shown in the [[pcb_mechanics#PCB Stackup|next section]]. At the edge of the board there are copper tabs extending from four IC's (TO-220 package) for heatsinking. Details on proper heatsinking are described in a [[pcb_mechanics#Thermal Management|later section]]. |
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| <WRAP center round info 60%> |
| Not all circuit boards will utilize all four heatsinking positions and therefore may have copper tabs in only a few positions. The four possible tab positions shown in the drawings will are fixed for every board even though a copper tab may not be utilized there. |
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<imgcaption singlePCB|PCB dimensions.>{{ :ice:single_pcb_dimensions.png?800 |}}</imgcaption> | <imgcaption singlePCB|PCB dimensions.>{{ :ice:single_pcb_dimensions.png?800 |}}</imgcaption> |
</WRAP> | </WRAP> |
===== PCB Stackup ===== | ===== PCB Stackup ===== |
The PCB's are designed to stack on one another with each of the board-to-board headers mating, thereby forming a power distribution and communications bus between boards. The PCB's can be stacked by using 0.5 inch length 4-40 standoffs ([[http://www.mcmaster.com/#93505a815/|McMaster-Carr PN: 93505A815]]) between boards in the four mounting holes at the corner as shown in <imgref stackedPCB>. The maximum stack height is 9 boards total. | The PCB's are designed to stack on one another with each of the board-to-board headers mating, thereby forming a power distribution and communications bus between boards. The PCB's can be stacked by using 0.5 inch length 4-40 standoffs ([[http://www.mcmaster.com/#93505a432/|McMaster-Carr PN: 93505A432]]) between boards in the four mounting holes at the corner as shown in <imgref stackedPCB>. The maximum stack height is 9 boards total. |
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<imgcaption stackedPCB|PCB stacking mechanics.>{{ :ice:stacked_pcb_dimensions.png |}}</imgcaption> | <imgcaption stackedPCB|PCB stacking mechanics.>{{ :ice:stacked_pcb_dimensions.png |}}</imgcaption> |
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<WRAP round download 30%> | <WRAP round download 30%> |
{{:ice:ice_pcb_stack_drawing_01.pdf|Technical Drawing}} | {{:ice:ice_board_high_detail_01_-_stack_of_9_boards_01.pdf|Technical Drawing}} |
</WRAP> | </WRAP> |
===== Thermal Management ===== | ===== Thermal Management ===== |
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<WRAP round download 30%> | <WRAP round download 30%> |
{{:ice:oem_board_stack_-_heat_sinking_wedge_spec_-_drawing_01.pdf|Technical Drawing}} | {{:ice:ice_heat_sinking_wedge_spec_-_drawing_01.pdf|Technical Drawing}} |
</WRAP> | </WRAP> |