ice:pcb_mechanics
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ice:pcb_mechanics [2014/07/01 17:40] – [PCB Dimensions] jtshugrue | ice:pcb_mechanics [2021/08/26 15:26] (current) – external edit 127.0.0.1 | ||
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This page presents the mechanical specifications for PCB's in the ICE Platform when being integrated by an OEM. | This page presents the mechanical specifications for PCB's in the ICE Platform when being integrated by an OEM. | ||
===== PCB Dimensions ===== | ===== PCB Dimensions ===== | ||
- | All PCB's in the ICE Platform follow identical board dimensions and header/ | + | All PCB's in the ICE Platform follow identical board dimensions and header/ |
- | < | + | <WRAP center round info 60%> |
+ | Not all circuit boards will utilize all four heatsinking positions and therefore may have copper tabs in only a few positions. The four possible tab positions shown in the drawings will are fixed for every board even though a copper tab may not be utilized there. | ||
+ | </ | ||
+ | |||
+ | < | ||
<WRAP round download 30%> | <WRAP round download 30%> | ||
- | {{:ice:ice_pcb_single_drawing_01.pdf|Technical Drawing}} | + | {{:ice:ice_board_high_detail_01.pdf|Technical Drawing}} |
</ | </ | ||
===== PCB Stackup ===== | ===== PCB Stackup ===== | ||
- | The PCB's are designed to stack on one another with each of the board-to-board headers mating, thereby forming a power distribution and communications bus between boards. The PCB's can be stacked by using 0.5 inch length 4-40 standoffs ([[http:// | + | The PCB's are designed to stack on one another with each of the board-to-board headers mating, thereby forming a power distribution and communications bus between boards. The PCB's can be stacked by using 0.5 inch length 4-40 standoffs ([[http:// |
- | <WRAP center round box 90%> | + | |
- | {{ : | + | <imgcaption stackedPCB|PCB stacking mechanics.>{{ : |
- | </WRAP> | + | |
<WRAP round download 30%> | <WRAP round download 30%> | ||
- | {{:ice:ice_pcb_stack_drawing_01.pdf|Technical Drawing}} | + | {{:ice:ice_board_high_detail_01_-_stack_of_9_boards_01.pdf|Technical Drawing}} |
</ | </ | ||
===== Thermal Management ===== | ===== Thermal Management ===== | ||
- | Each PCB exposes up to 4 copper tabs to conduct heat out from power dissipating components to an external heat sink. The copper tabs are not electrically isolated, so electrical isolation is **required** at the interface between the heatsink and copper tab. Failure to isolate these tabs will result in malfunction of the ICE module. For electrical isolation with good thermal conductivity, | + | Each PCB exposes up to 4 copper tabs to conduct heat out from power dissipating components to an external heat sink. The copper tabs are not electrically isolated, so electrical isolation is **required** at the interface between the heatsink and copper tab. Failure to isolate these tabs will result in malfunction of the ICE module. For electrical isolation with good thermal conductivity, |
<WRAP center round important 60%> | <WRAP center round important 60%> | ||
The copper tabs **must** be electrically isolated from the heatsink. For electrical isolation with good thermal conductivity, | The copper tabs **must** be electrically isolated from the heatsink. For electrical isolation with good thermal conductivity, | ||
</ | </ | ||
- | <WRAP center round box 60%> | + | <imgcaption stackup1|Overall pcb heatsink stackup.>{{ : |
- | {{ : | + | |
- | </WRAP> | + | |
- | <WRAP center round box 60%> | + | <imgcaption stackup2|Top view of the stackup.>{{ : |
- | {{ : | + | |
- | </WRAP> | + | < |
- | <WRAP center round box 60%> | ||
- | {{ : | ||
- | </ | ||
<WRAP round download 30%> | <WRAP round download 30%> | ||
- | {{:ice:oem_board_stack_-_heat_sinking_wedge_spec_-_drawing_01.pdf|Technical Drawing}} | + | {{:ice:ice_heat_sinking_wedge_spec_-_drawing_01.pdf|Technical Drawing}} |
</ | </ | ||
- |
ice/pcb_mechanics.1404236401.txt.gz · Last modified: 2021/08/26 14:26 (external edit)