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ice:oem_integration [2014/07/22 13:35]
jtshugrue [Board Connections]
ice:oem_integration [2020/03/05 17:55]
Michael Radunsky
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-Power can be provided directly to the internal power bus headers if no master controller is used in the system, but this is highly discouraged as the power requirements are much more strict in order to prevent damaging system components. There are three power bus connectors shown in <imgref pcbSchematic> that utilize 0.1 inch double row board to board headers. The 6x2 headers ([[http://cloud.samtec.com/catalog_english/ESQ_TH.PDF|Samtec PN: ESQ-106-13-T-D]]) on either side of the pcb  carry 5V_A, +15V, +12V, -12V, -15V power rails and GND_A and GND signal. Both of the headers must be powered by the same power rails and be connected to the same grounds. The signal name GND_A is the return current path for the 5V_A rail which provides high current to daughter modules which require it (such as the [[ice:quadtemp|ICE-QT1]]). The 4x2 header ([[http://cloud.samtec.com/catalog_english/ESQ_TH.PDF|Samtec PN: ESQ-104-13-T-D]]) in the center of the pcb carries the digital communications bus and +5V_D power rail. The 5V_D power rail is designed to provide power to noisier digital components without contaminating the other analog power rails. This power rail can be "starred" off of the 5V_A line. All ground connections (GND, GND_A, GND_D) are intended to be starred at the power supply. The power sequence for turning on and off each voltage rail must be followed as described in the [[ice:oem_integration#power_sequencing|power sequencing section]] or damage will occur.+Power can be provided directly to the internal power bus headers if no master controller is used in the system, but this is highly discouraged as the power requirements are much more strict in order to prevent damaging system components. There are three power bus connectors shown in <imgref pcbSchematic> that utilize 0.1 inch double row board to board headers. The 6x2 headers ([[http://cloud.samtec.com/catalog_english/ESQ_TH.PDF|Samtec PN: ESQ-106-13-T-D]]) on either side of the PCB  carry 5V_A, +15V, +12V, -12V, -15V power rails and GND_A and GND signal. Both of the headers must be powered by the same power rails and be connected to the same grounds. The signal name GND_A is the return current path for the 5V_A rail which provides high current to daughter modules which require it (such as the [[ice:quadtemp|ICE-QT1]]). The 4x2 header ([[http://cloud.samtec.com/catalog_english/ESQ_TH.PDF|Samtec PN: ESQ-104-13-T-D]]) in the center of the PCB carries the digital communications bus and +5V_D power rail. The 5V_D power rail is designed to provide power to noisier digital components without contaminating the other analog power rails. This power rail can be "starred" off of the 5V_A line. All ground connections (GND, GND_A, GND_D) are intended to be starred at the power supply. The power sequence for turning on and off each voltage rail must be followed as described in the [[ice:oem_integration#power_sequencing|power sequencing section]] or damage will occur.
 ==== Power Draw by Module ==== ==== Power Draw by Module ====
-The power supply capacity for the supply used to power the ICE stack must be sized appropriately to handle expected power draw for the modules selected. Current draw is listed in the specifications for each of the daughter modules. The typical values indicate the quiescent current draw, and the max values represent worst case power draw depending on the functionality of the board. For example, the [[ice:quadtemp|ICE-QT1]] quad temperature controller has a maximum expected current draw on the 5V_A rail that depends on the maximum current supplied to thermo-electric coolers (TEC's). The maxiumum current here depends on what the user sets the current limit to for each temperature controller section. The max spec given is based on the highest current limit being set for each section, and the power supply should be capable of supply that current unless those current limits are set lower. Another example are the [[ice:servo-peaklock|ICE-CS1]] and [[ice:servo-opls|ICE-CP1]] modules, both of which include a laser current controller. The current draw on the +15V depends on the laser current output, which has a maximum output current that can be used to determine total current draw. This is detailed in the specifications charts on the respective product pages for all these modules.+The power supply capacity for the supply used to power the ICE stack must be sized appropriately to handle expected power draw for the modules selected. Current draw is listed in the specifications for each of the daughter modules. The typical values indicate the quiescent current draw, and the max values represent worst case power draw depending on the functionality of the board. For example, the [[ice:quadtemp|ICE-QT1]] quad temperature controller has a maximum expected current draw on the 5V_A rail that depends on the maximum current supplied to thermo-electric coolers (TEC's). The maximum current here depends on what the user sets the current limit to for each temperature controller section. The max spec given is based on the highest current limit being set for each section, and the power supply should be capable of supply that current unless those current limits are set lower. Another example are the [[ice:servo-peaklock|ICE-CS1]] and [[ice:servo-opls|ICE-CP1]] modules, both of which include a laser current controller. The current draw on the +15V depends on the laser current output, which has a maximum output current that can be used to determine total current draw. This is detailed in the specifications charts on the respective product pages for all these modules.
  
 The [[ice:master|ICE-MC1 master controller]] and ICE power bus have a maximum amount of current that can be routed. This is specified in the [[ice:master#specifications|maximum power consumption specification]] on the [[ice:master|ICE-MC1 product page]]. When choosing how many and which type of each daughter module a master controller can support, the expected current draw of all daughter modules must not exceed the maximum power consumption specification for the master controller. For example, the master controller and ICE power bus can only distribute a maximum of 10 amps on the 5V_A rail. If three [[ice:quadtemp|ICE-QT1]] temperature controllers were chosen as daughter modules, and all the TEC current limits were left at maximum, the three modules could potentially draw 12 amps. This would exceed the capacity of the power bus and master controller. The master controller provide over-current protection, so it would shut down power to the daughter modules and enter a fault condition if 12 amps were attempted to be drawn from the 5V_A rail. The [[ice:master|ICE-MC1 master controller]] and ICE power bus have a maximum amount of current that can be routed. This is specified in the [[ice:master#specifications|maximum power consumption specification]] on the [[ice:master|ICE-MC1 product page]]. When choosing how many and which type of each daughter module a master controller can support, the expected current draw of all daughter modules must not exceed the maximum power consumption specification for the master controller. For example, the master controller and ICE power bus can only distribute a maximum of 10 amps on the 5V_A rail. If three [[ice:quadtemp|ICE-QT1]] temperature controllers were chosen as daughter modules, and all the TEC current limits were left at maximum, the three modules could potentially draw 12 amps. This would exceed the capacity of the power bus and master controller. The master controller provide over-current protection, so it would shut down power to the daughter modules and enter a fault condition if 12 amps were attempted to be drawn from the 5V_A rail.
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-Generally, the minimum bend radius for flat flex jumper cables is 2mm. The length of the stiffener behind the exposed contacts on the cable will determine how far out from the FFC pcb connector the first bend of the flat flex cable can occur. The clearance for this bend must be accounted for when designing an enclosure for the ICE boards. For example, with Molex brand flat flex cables, there needs to be a minimum 0.25 inch clearance from the front of the flat flex pcb connector to allow the cable to bend. Verify against the data sheet of the chosen flat flex jumper cable.+Generally, the minimum bend radius for flat flex jumper cables is 2mm. The length of the stiffener behind the exposed contacts on the cable will determine how far out from the FFC PCB connector the first bend of the flat flex cable can occur. The clearance for this bend must be accounted for when designing an enclosure for the ICE boards. For example, with Molex brand flat flex cables, there needs to be a minimum 0.25 inch clearance from the front of the flat flex PCB connector to allow the cable to bend. Verify against the data sheet of the chosen flat flex jumper cable.
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 This section details considerations for communicating with ICE modules in the system. For pin definitions and types of connectors for interfacing with the ICE stack, refer to the [[ice:master|ICE-MC1 master controller product page]]. This section details considerations for communicating with ICE modules in the system. For pin definitions and types of connectors for interfacing with the ICE stack, refer to the [[ice:master|ICE-MC1 master controller product page]].
 ==== I2C Addressing ==== ==== I2C Addressing ====
-The ICE board stack uses an [[http://en.wikipedia.org/wiki/I%C2%B2C|I2C communication bus]] to control each board. I<sup>2</sup>C is an addressable protocal, therefore each ICE daughter module needs to have a unique address set. Up to 8 daughter modules (not including the [[ice:master|ICE-MC1]] master controller) can be stacked together. Each ICE circuit board has a 3 position DIP switch (shown in <imgref dipSwitch>) installed that allows the setting of each modules I<sup>2</sup>C address (between 0-7). The selection of address is in binary with DIP position 1 corresponding to the least significant bit. Setting a bit "HIGH" is done by sliding the switch to the side marked with the word "ON", which is shown highlighted in <imgref dipSwitchDiagram>. An example address setting is shown in <tabref i2cAddrEx>. Valid I<sup>2</sup>C addresses are from 0-7, and every ICE module must be set to have a unique address or communications bus collisions will occur.+The ICE board stack uses an [[http://en.wikipedia.org/wiki/I%C2%B2C|I2C communication bus]] to control each board. I<sup>2</sup>C is an addressable protocol, therefore each ICE daughter module needs to have a unique address set. Up to 8 daughter modules (not including the [[ice:master|ICE-MC1]] master controller) can be stacked together. Each ICE circuit board has a 3 position DIP switch (shown in <imgref dipSwitch>) installed that allows the setting of each modules I<sup>2</sup>C address (between 0-7). The selection of address is in binary with DIP position 1 corresponding to the least significant bit. Setting a bit "HIGH" is done by sliding the switch to the side marked with the word "ON", which is shown highlighted in <imgref dipSwitchDiagram>. An example address setting is shown in <tabref i2cAddrEx>. Valid I<sup>2</sup>C addresses are from 0-7, and every ICE module must be set to have a unique address or communications bus collisions will occur.
  
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ice/oem_integration.txt · Last modified: 2020/03/05 17:55 by Michael Radunsky