ice:pcb_mechanics
Differences
This shows you the differences between two versions of the page.
Both sides previous revisionPrevious revisionNext revision | Previous revisionLast revisionBoth sides next revision | ||
ice:pcb_mechanics [2014/06/30 18:51] – [PCB Dimensions] jtshugrue | ice:pcb_mechanics [2014/07/02 18:24] – Added another sil pad figure ref jtshugrue | ||
---|---|---|---|
Line 2: | Line 2: | ||
This page presents the mechanical specifications for PCB's in the ICE Platform when being integrated by an OEM. | This page presents the mechanical specifications for PCB's in the ICE Platform when being integrated by an OEM. | ||
===== PCB Dimensions ===== | ===== PCB Dimensions ===== | ||
- | All PCB's in the ICE Platform follow identical board dimensions and header/ | + | All PCB's in the ICE Platform follow identical board dimensions and header/ |
- | <WRAP center round box 90%> | + | |
- | {{ : | + | <WRAP center round info 60%> |
+ | Not all circuit | ||
</ | </ | ||
+ | |||
+ | < | ||
<WRAP round download 30%> | <WRAP round download 30%> | ||
- | {{:ice:ice_pcb_single_drawing_01.pdf|Technical Drawing}} | + | {{:ice:ice_board_high_detail_01.pdf|Technical Drawing}} |
</ | </ | ||
- | |||
===== PCB Stackup ===== | ===== PCB Stackup ===== | ||
- | The PCB's are designed to stack on one another with each of the board-to-board headers mating, thereby forming a power distribution and communications bus between boards. The PCB's can be stacked by using 0.5 inch length 4-40 standoffs between boards in the four mounting holes at the corner. The maximum stack height is 9 boards total. | + | The PCB's are designed to stack on one another with each of the board-to-board headers mating, thereby forming a power distribution and communications bus between boards. The PCB's can be stacked by using 0.5 inch length 4-40 standoffs |
- | <WRAP center round box 90%> | + | |
- | {{ : | + | <imgcaption stackedPCB|PCB stacking mechanics.>{{ : |
- | </WRAP> | + | |
<WRAP round download 30%> | <WRAP round download 30%> | ||
- | {{:ice:ice_pcb_stack_drawing_01.pdf|Technical Drawing}} | + | {{:ice:ice_board_high_detail_01_-_stack_of_9_boards_01.pdf|Technical Drawing}} |
</ | </ | ||
===== Thermal Management ===== | ===== Thermal Management ===== | ||
- | Each PCB exposes up to 4 copper tabs to conduct heat out from power dissipating components to an external heat sink. The copper tabs are not electrically isolated, so electrical isolation is required at the interface between the heatsink and copper tab. Failure to isolate these tabs will result in malfunction of the ICE module. For electrical isolation with good thermal conductivity, | + | Each PCB exposes up to 4 copper tabs to conduct heat out from power dissipating components to an external heat sink. The copper tabs are not electrically isolated, so electrical isolation is **required** at the interface between the heatsink and copper tab. Failure to isolate these tabs will result in malfunction of the ICE module. For electrical isolation with good thermal conductivity, |
- | <WRAP center round box 60%> | + | <WRAP center round important |
- | {{ :ice: | + | The copper tabs **must** be electrically isolated from the heatsink. For electrical isolation with good thermal conductivity, |
</ | </ | ||
- | <WRAP center round box 60%> | + | <imgcaption stackup1|Overall pcb heatsink stackup.>{{ : |
- | {{ : | + | |
- | </WRAP> | + | < |
+ | |||
+ | < | ||
- | <WRAP center round box 60%> | ||
- | {{ : | ||
- | </ | ||
<WRAP round download 30%> | <WRAP round download 30%> | ||
- | {{:ice:oem_board_stack_-_heat_sinking_wedge_spec_-_drawing_01.pdf|Technical Drawing}} | + | {{:ice:ice_heat_sinking_wedge_spec_-_drawing_01.pdf|Technical Drawing}} |
</ | </ | ||
- |
ice/pcb_mechanics.txt · Last modified: 2021/08/26 15:26 by 127.0.0.1