ice:oem_integration
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| ice:oem_integration [2014/07/15 00:36] – [Thermal Management] Michael Radunsky | ice:oem_integration [2014/07/15 00:40] – [Overview] Michael Radunsky | ||
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| Considerations for integrating the ICE Platform stack in an OEM situation are detailed in the remainder of this document. Important key points include deciding on the type and quantity of daughter modules to use and how that relates to the overall power budget for both the power supply and the maximum currents that can be routed through the power bus. The mechanics of mounting the circuit boards and designing a thermal management system must also be designed. Connections for communication and I/O from the circuit boards to the integrator' | Considerations for integrating the ICE Platform stack in an OEM situation are detailed in the remainder of this document. Important key points include deciding on the type and quantity of daughter modules to use and how that relates to the overall power budget for both the power supply and the maximum currents that can be routed through the power bus. The mechanics of mounting the circuit boards and designing a thermal management system must also be designed. Connections for communication and I/O from the circuit boards to the integrator' | ||
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| ===== Power Requirements ===== | ===== Power Requirements ===== | ||
| ==== Power Entry ==== | ==== Power Entry ==== | ||
ice/oem_integration.txt · Last modified: 2021/08/26 15:26 by 127.0.0.1